电路板检测

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注意：因业务调整，暂不接受个人委托测试望见谅。

电路板检测范围

硬件,电子产品,制造业,工业设备,电子元件,嵌入式系统,电路设计,半导体,电子工程,电源管理,电子制造,电路分析,电子设备,电路组件,电子通讯,数字电路,模拟电路,集成电路,电路连接

电路板检测项目

表面贴装检测,元件焊接质量检测,电路板结构检测,线路通断测试,阻抗测试,飞针测试,耐压测试,介电强度测试,结构可靠性测试,热冲击测试,湿热循环测试,盐雾测试,静电放电测试,ESD测试,EMC测试,射频测试,高频测试,噪声测试,震动测试,冲击测试,可靠性寿命测试

电路板检测方法

Visual Inspection: This method involves examining the circuit board with the naked eye to detect any visible defects such as cracks, scratches, or soldering issues.

X-ray Inspection: X-ray imaging can be used to inspect the internal structure of the circuit board, revealing hidden defects such as faulty solder joints or internal shorts.

Electrical Testing: This method involves sending electrical signals through the circuit board to test for proper functionality and identify any faulty components or connections.

Thermal Imaging: Thermal cameras can be used to detect hotspots on the circuit board, indicating potential issues such as overheating components or poor thermal management.

Scanning Electron Microscopy (SEM): SEM can be used to provide high-resolution images of the circuit board surface, allowing for detailed inspection of the circuit traces and components.

Microsection Analysis: This method involves slicing a small portion of the circuit board for microscopic examination to identify defects such as delamination, voids, or cracks in the layers.

Ion Chromatography: Ion chromatography can be used to analyze the cleanliness of the circuit board by detecting and measuring ionic residues left behind during the manufacturing process.

Environmental Testing: Environmental testing involves subjecting the circuit board to various environmental conditions such as temperature, humidity, and vibration to assess its performance and reliability under different circumstances.

Component Testing: Individual components on the circuit board can be tested using specific methods such as continuity checks, capacitance measurements, or in-circuit testing to verify their functionality.

Failure Analysis: In case of a malfunctioning circuit board, failure analysis techniques can be employed to identify the root cause of the issue, which may involve a combination of different testing methods and analysis tools.

电路板检测仪器

示波器, 频谱仪, 万用表, 逻辑分析仪, 示波扫描仪, 模拟信号发生器, 数字信号发生器, 电源源波器, 高阻计, 频率计, 阻抗分析仪, 热像仪, 核磁共振仪, 紫外-可见吸收光谱仪, 质谱仪, 气相色谱仪, 液相色谱仪, 微量分析仪, 表面扫描仪, X射线衍射仪

电路板检测标准

CNS 10850-2000：印刷电路板通则

CNS 10851-2000：多层印刷电路板

QJ 2830-1996：印制电路板导轨规范

QJ 3103A-2011：印制电路板设计要求

CNS 10852-2000：印刷电路板检验法

CNS 10562-2000：单、双面印刷电路板

QJ 201A-1999：印制电路板通用规范

QJ 519A-1999：印制电路板试验方法

HG/T 4239-2011(2017)：印刷电路板用银盐胶片

HG/T 4396-2012：印刷电路板用重氮盐胶片

HG/T 4396-2012(2017)：印刷电路板用重氮盐胶片

CNS 14735-3-2003：印刷电路板设计与应用

SJ 20904-2004：软基材微波电路板设计指南

HG/T 4239-2011：印刷电路板用银盐胶片

GB 51127-2015：印刷电路板工厂设计规范

QJ 2152-1991：挠性印制电路板技术条件

QJ 518-1980：印制电路板外形尺寸系列

SJ 21150-2016：微波组件印制电路板设计指南

CNS 8427-1982：印刷电路板用玻璃纤维席

QJ 831B-2011：航天用多层印制电路板通用规范

SJ 20776-2000：印制电路板版图数据格式 Gerber

QJ 3015-1998：印制电路板图形转移工艺技术要求

QJ 832B-2011：航天用多层印制电路板试验方法

HJ 450-2008：清洁生产标准 印制电路板制造业

SJ 21548-2020：印制电路板组装件静态应变测试方法

CNS 14735-9-2003：具导孔之软性多层印刷电路板规格

QJ 2776-1995：印制电路板通断测试要求和方法

QJ 1890-1990：印制电路板对外连接方式及设计规范

GB/T 33377-2016：软性电路板覆盖膜用非硅离型材料

QJ 1462A-1999：印制电路板酸性光亮镀铜工艺技术要求

实验仪器

测试流程

注意事项

1.具体的试验周期以工程师告知的为准。

2.文章中的图片或者标准以及具体的试验方案仅供参考，因为每个样品和项目都有所不同，所以最终以工程师告知的为准。

3.关于（样品量）的需求，最好是先咨询我们的工程师确定，避免不必要的样品损失。

4.加急试验周期一般是五个工作日左右，部分样品有所差异

5.如果对于（电路板检测）还有什么疑问，可以咨询我们的工程师为您一一解答。